HIGH-DENSITY / HIGH-ATTENUATION FILTERING
Planar Array Filter Connectors
Compact, repeatable EMI/RFI filtering—including Pi planar configurations for very high attenuation requirements.
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Request a Quote ↗INTEGRATED EMI / RFI FILTERING
Connector-level filtering engineered for demanding aerospace and defense systems.
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ENGINEERED TO REQUIREMENTOVERVIEW
RCV filtered connectors combine the mechanical interface and EMI filtering into one purpose-built component. We work directly with your team to align capacitance, layout, shell style, termination, and environmental requirements with the real application.
SELECT A FILTER TECHNOLOGY
Explore each filtered connector technology to compare construction, electrical flexibility, and typical application fit.
HIGH-DENSITY / HIGH-ATTENUATION FILTERING
Compact, repeatable EMI/RFI filtering—including Pi planar configurations for very high attenuation requirements.
Explore technology ↗TUBE-BASED HIGH-ATTENUATION FILTERING
Tube-based Pi filtering for higher attenuation requirements and demanding noise environments.
Explore technology ↗FLEXIBLE FILTERING & CIRCUIT PROTECTION
Flexible component-level filtering and protection using chip capacitors, TVS diodes, and resistors.
Explore technology ↗CONNECTOR-LEVEL EMI CONTROL
A filtered connector places the filter network at the enclosure interface, helping control conducted electromagnetic interference before it reaches sensitive circuitry. RCV engineers custom filtered connector solutions for MIL-DTL-38999 and other circular connector platforms, matching the electrical architecture, contact layout, shell, and termination to the application.
Planar array and Pi tube technologies both support higher-attenuation requirements, while chip-on-flex construction adds flexible component selection—including chip capacitors, TVS diodes, and resistors. Available configurations include C and Pi filter topologies, pin or socket contacts, solder terminations, and PC tails.
A filtered connector combines a connector interface with integrated EMI/RFI filter components, reducing the need to place every filtering element deeper inside the equipment.
Filtering at the enclosure boundary can help keep unwanted conducted energy from entering or leaving the system and can simplify downstream board-level filtering.
RCV supports planar array, Pi tube, and chip-on-flex connector technologies, selected around attenuation, packaging, component, and program requirements.
Yes. Chip-on-flex configurations can integrate TVS diodes and resistors alongside chip capacitors when the application requires filtering and circuit-protection functions.
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